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166 积分 2025-06-02 加入
Structural and Optoelectronic Characterization of Synthesized Undoped CZTS and Cd-doped CZTS Thin Films
1个月前
已关闭
Glass interposer technology advances for high density packaging
1个月前
已完结
Effects of Metal Frame and Adhesive on Thermally-Induced Warpage and Stress of 2.5D Packages: Experimental and Numerical Studies
1个月前
已完结
Study of the thermo-mechanical behavior of glass interposer for flip chip packaging applications
1个月前
已完结
The interfacial reliability of through-glass vias for 2.5D integrated circuits
1个月前
已完结
The Interfacial Delamination and Fracture Behavior of Cu-filled Through Glass Vias (TGVs) Interposer Package with Multi-Layer RDLs under Thermo-mechanical Loads
1个月前
已完结
Thermo-mechanical reliability of glass substrate and Through Glass Vias (TGV): A comprehensive review
1个月前
已完结
Analytical and finite element modeling of through glass via thermal stress
1个月前
已完结
Simulation of the Dynamic Process and Quality-Influencing Mechanisms in Wafer-to-Wafer Hybrid Bonding
1个月前
已完结
Board-Level Reliability of 100 × 100 mm Large Glass Packages: Warpage and Thermomechanical Reliability for AI/HPC Applications
1个月前
已完结
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