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42 积分 2025-06-02 加入
Reliability analysis of TSV silicon perforated structures under thermal cyclic loading
3天前
已完结
Reliability Concerns of TSV-Based 3-D Integration: Impact of Interfacial Crack
4天前
已完结
Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
9天前
已完结
A comprehensive finite element model for simulating reflow profile of a BGA package
1个月前
已完结
Reflow profile simulation by finite element method for a BGA package
1个月前
已完结
Analysis of Thermal Expansion Behavior and Interface Evolution of TSV Under Thermal Cycle Loading Based on Crystal Plastic Finite Element Method
3个月前
已完结
Development of Glass core substrate with the stress analysis, transmission characteristics and reliability
3个月前
已完结
Evolution of Electrical Transmission Characteristics in TSV and TGV Interconnect Structures Under Thermal Loading
3个月前
已完结
Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer With Through-Silicon Via
3个月前
已完结
Signal Integrity Analysis for Resistive Random Access Memory Crossbar Array by Compact Model With Consideration of Electro-Thermal Coupling Effects
3个月前
已完结
An integrated prediction model using machine learning and dynamics simulation for the selection of transdermal penetration enhancers
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