Lv22
126 积分 2025-06-02 加入
Analysis of Thermal Expansion Behavior and Interface Evolution of TSV Under Thermal Cycle Loading Based on Crystal Plastic Finite Element Method
4小时前
已完结
Development of Glass core substrate with the stress analysis, transmission characteristics and reliability
4小时前
已完结
Evolution of Electrical Transmission Characteristics in TSV and TGV Interconnect Structures Under Thermal Loading
4小时前
已完结
Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer With Through-Silicon Via
6小时前
已完结
Signal Integrity Analysis for Resistive Random Access Memory Crossbar Array by Compact Model With Consideration of Electro-Thermal Coupling Effects
6小时前
已完结
Glass Package With Multiple Embedded Dies for mmWave Applications
1天前
已关闭
Development of Straight, Small-Diameter, High-Aspect Ratio Copper-Filled Through-Glass Vias (TGV) for High-Density 3D Interconnections
1天前
已完结
Structural and Optoelectronic Characterization of Synthesized Undoped CZTS and Cd-doped CZTS Thin Films
3个月前
已关闭
Glass interposer technology advances for high density packaging
3个月前
已完结
Effects of Metal Frame and Adhesive on Thermally-Induced Warpage and Stress of 2.5D Packages: Experimental and Numerical Studies
3个月前
已完结
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