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298 积分 2026-07-11 加入
Research progress in interface optimization and preparation technology of high thermal conductivity diamond/copper composite materials
10天前
已完结
Research Progress of Interfacial Modification of Copper/Diamond Composites for Electronic Packaging
10天前
已完结
Progress in the Copper-Based Diamond Composites for Thermal Conductivity Applications
10天前
已完结
Latest Developments to Manufacture Metal Matrix Composites and Functionally Graded Materials through AM: A State-of-the-Art Review
10天前
已完结
Interface engineering toward high thermal conductivity in diamond composites
10天前
已完结
Study on diamond/aluminum composites packaging material applied to microwave power components
10天前
已完结
Study on Thermal Conductivity of Aluminum/Diamond Composites
10天前
已关闭
Latest research progress of SiCp/Al composite for electronic packaging
10天前
已完结
Effect of Ta metallic layer on heat dissipation performance of Diamond/Cu composites composed of CVD diamond wafer with sputtered Cu/Ta bilayers and electroplated Cu coating
10天前
已完结
Thermal Characterization of Metal-Diamond Composite Heat Spreaders Using Low-Frequency-Domain Thermoreflectance
10天前
已完结
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