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32 积分 2026-07-30 加入
Group III-A Nitrides on Si: Stress and Microstructural Evolution
2天前
求助中
Research on deep trench capacitor structure design and its effect on capacitance density and breakdown voltage
4天前
已完结
Ultra-High Density Deep Trench Capacitor (DTC) for 3DIC Integration
4天前
已完结
A manufacturable interposer MIM decoupling capacitor with robust thin high-K dielectric for heterogeneous 3D IC CoWoS wafer level system integration
4天前
已完结
Wafer Level System Integration of the Fifth Generation CoWoS®-S with High Performance Si Interposer at 2500 mm2
4天前
已完结
Integrated Deep Trench Capacitor in Si Interposer for CoWoS Heterogeneous Integration
4天前
已完结
Through glass via technology for advanced packaging: fabrication, metallization, applications, and reliability challenges
5天前
已完结
A High-Density 3-D Capacitor Using Through Glass Via Structure
14天前
已完结
Purge Effect Simulation of Atomic Layer Deposition for High Aspect Ratio Structure
1个月前
已完结
Atomic layer deposition of metal and metal oxides: Mechanisms, challenges, and future prospects
2个月前
已完结
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