Lv6
2200 积分 2023-12-26 加入
Manufacturing Carbon-Doped Stamp With Surface Microstructures for Rapid and Reliable Micro-LED Transfer Process
1天前
已完结
Effect of Die Shape and Size on Performance of GaN-Based Resonator Micro-LEDs
1天前
已完结
Feedback-Enhanced Color Purity Film for Improved Color Saturation and Conversion Efficiency in Full-Color Micro-LED Displays
1天前
已完结
A Co-Planarized Common Cathode Micro-LED Display That Is Produced Using Planarization and a Copper Process
1天前
已完结
Thermal-stress analysis of contact problems by the finite element method
1天前
已关闭
A novel insight into Au-Au thermosonic flip chip joint under extreme thermal cycles: Defect characterization and failure analysis
1天前
已关闭
Finite element analysis of elasto-plastic tee joints
1天前
已关闭
Analysis and optimization of mixed-mode conical adhesively bonded joints under thermo-mechanical loadings
1天前
已关闭
Advanced technologies in InGaN micro-LED fabrication to mitigate the sidewall effect
2天前
已完结
A simplified and high yield method for Micro-LED integration: Substitution of metal bumps with conductive photoresist in high-precision mass transfer
2天前
已关闭
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