Lv41
538 积分 2026-03-30 加入
Achieving enhanced strength in tetragonal ZnO whiskers reinforced In-45.6Sn-5Bi composite solder via NiO coating
9天前
已完结
Investigation of Sn–Bi–In ternary solders with compositions varying from In–Sn eutectic to 59 °C ternary eutectic point
9天前
已完结
Effect of Ag content on microstructure and shear properties of In-Sn-Zn-Bi solder joints
9天前
已完结
Effect of Bonding Time on the Microstructure, IMC Growth Behavior, and Shear Properties of Cu/In-48Sn-10Ag/Cu 3D Packaging Solder Joints
29天前
已完结
Effect of Bonding Time on the Microstructure, IMC Growth Behavior, and Shear Properties of Cu/In-48Sn-10Ag/Cu 3D Packaging Solder Joints
29天前
已完结
The Variations of Electron and Phonon Contributions to the Thermal Conductivity with Temperature in the Sn–Bi–In–Zn Alternative Lead-Free Solder Alloys
29天前
已完结
Effect of CuZnAl particle addition on the microstructure and shear property of Cu/In-48Sn/Cu solder joints by transient liquid phase bonding
1个月前
已完结
A novel nonlinear ADRC-based secondary frequency control strategy for droop control in islanded microgrids
1个月前
已采纳
RURBAN-Map: A knowledge-guided framework for nationwide fine-scale urban-rural land use mapping in China
1个月前
已采纳
Investigating the impact of temperature on oil shale conversion via supercritical methanolysis: Experimentation, characterization and mechanism insight
1个月前
已采纳
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