Lv4
450 积分 2025-02-27 加入
Novel model of material removal rate on ultrasonic-assisted chemical mechanical polishing for sapphire
8天前
已完结
Enhanced polishing performance and tribo-chemical removal mechanism of sapphire wafers under gas-assisted CMP (GA-CMP)
8天前
已完结
Effect of mechanical process parameters on friction behavior and material removal during sapphire chemical mechanical polishing
8天前
已完结
Effect of Abrasive Concentration on Chemical Mechanical Polishing of Sapphire
8天前
已完结
Macro and micro-nano machining mechanism for ultrasonic vibration assisted chemical mechanical polishing of sapphire
8天前
已完结
Characterization of sapphire chemical mechanical polishing performances using silica with different sizes and their removal mechanisms
9天前
已完结
Multi grade polishing pad for sapphire chemical mechanical polishing
9天前
已完结
Contrast Experiments in Dielectrophoresis Polishing (DEPP)/Chemical Mechanical Polishing (CMP) of Sapphire Substrate
12天前
已完结
Effects of polishing parameters on surface quality in sapphire double-sided CMP
2个月前
已完结
Effect of different grinding strategies on subsequent polishing processes of sapphire
2个月前
已完结
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