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34 积分 2023-02-21 加入
Digital Image Correlation: from Displacement Measurement to Identification of Elastic Properties – a Review
28天前
已完结
Transformer insulation aging assessment and life prediction based on a variety characteristics
3个月前
已完结
Backplate-reinforced structures for enhancing solder joint reliability of server CPU assembly under thermal cycling
4个月前
已完结
Effect of Warpage on Solder Joint Fatigue Life by Influencing the Solder Joint Shape in BGA Packages
4个月前
已完结
Elimination of Die-Pop Defect by Vacuum Reflow for Ultrathin Die With Warpage in Semiconductor Packaging Assembly
4个月前
已完结
Thermal-induced warpage characterization for laminated packaging with three-dimensional thermoelasticity modeling and projection moiré measurement
4个月前
已完结
Revealing mechanisms of residual stress development in additive manufacturing via digital image correlation
5个月前
已完结
Warpage Optimization for SiC MOSFET Multichip Fan-Out Panel-Level Packaging With Thermal–Mechanical Finite-Difference Numerical Modeling and In Situ Digital Image Correlation Validation
5个月前
已完结
A comparative study of residual stress measurement of laminated composites using FBG sensor, DIC technique, and strain gauge
5个月前
已完结
Study of package warp behavior for high-performance flip-chip BGA
5个月前
已完结
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