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208 积分 2025-02-19 加入
Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures
20天前
已完结
Fracture behavior and constitutive relations of Sn-3.0Ag-0.5Cu solder alloy at cryogenic temperature
20天前
已完结
Tensile behavior of lead-free SAC305 solder: constitutive modeling and fracture mechanisms
20天前
已完结
Determination of Anand constants for SAC solders using stress-strain or creep data
20天前
已完结
Dependencies of Temperature Sensitive Electrical Parameters and Influence of Degradation in Silicon Carbide MOSFETs: A Review
1个月前
已完结
Influence of the combined effects of solder voids and wire lift-off on the power-cycling lifetime of power semiconductor packages
1个月前
已完结
Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module
1个月前
已完结
Stress evolution characteristics of packaging structures with embedded piezoresistive sensors under thermal cycling loads
1个月前
已完结
FE analysis the effect of bonding wire and solder failure on the resistance and temperature of IGBT
1个月前
已完结
Research on the impact of grain orientation and microstructure on solder reliability in power modules via crystal plasticity modeling
1个月前
已完结
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