| 标题 |
Research on the impact of grain orientation and microstructure on solder reliability in power modules via crystal plasticity modeling |
| 网址 | |
| DOI | |
| 其它 |
期刊:Materials Science and Engineering: B 作者:Hui Li; Xin Lan; Jie Cao; Xing Wang; Xianglong Liu; et al 出版日期:2026-01-01 |
| 求助人 | |
| 下载 |
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(2025-6-4)