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Comprehensive Fault Isolation Technologies for the Gate-All-Around Transistor and Backside Power Delivery Paradigm Shifts 1天前 求助中
Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing 1天前 已完结
Intel 18A Platform Technology Featuring RibbonFET (GAA) and PowerVia for Advanced High-Performance Computing 2天前 已完结
A16 Angstrom-Class CMOS Technology Featuring Enhanced Nanosheet Transistors with Super Power Rail (Backside Direct Contact Power Delivery) for AI and HPC Applications 2天前 已完结
Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network 3个月前 已完结
BS-PDN Implemented the Latest Logic Devices for 14 Angstrom Technology Node 3个月前 已完结
Block-level Evaluation and Optimization of Backside PDN for High-Performance Computing at the A14 node 3个月前 已完结
Nano-Through Silicon Vias (nTSV) for Backside Power Delivery Networks (BSPDN) 3个月前 已完结

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grateful，Like，That's fast!，This was a huge help. 1天前
grateful，Like，That's fast!，This was a huge help. 1天前
thanks :)，grateful，Like，That's fast!，This was a huge help. 2天前
grateful，That's fast!，This was a huge help. 3个月前
速度真快，点赞 3个月前
感谢，点赞，速度真快 3个月前
grateful，That's fast!，This was a huge help. 3个月前

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