Lv3
350 积分 2025-02-12 加入
Co-packaged optics for high-performance computing and artificial intelligence
1个月前
已完结
Through glass via technology for advanced packaging: fabrication, metallization, applications, and reliability challenges
1个月前
已完结
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits
1个月前
已完结
Low-Loss Optical Interconnect Designs in Optimized Glass for Co-Packaged Optics
1个月前
已完结
Design and Simulation of a Novel Integrated Opto-Electronic Through-Glass-Via (TGV) Structure for Co-Packaged Optics (CPO) Applications
1个月前
已完结
Optimizing laser-induced deep etching technique for micromachining of NXT glass
1个月前
已完结
Development of Long-term Reliability for Glass Core Substrates with Build-up layers
2个月前
已完结
Glass Wafer Level Packaging Enabled by Laser Induced Deep Etching of Closed Cavities
2个月前
已完结
Advancing Chiplet Architecture Through Heterogeneous Integration on Laser-processed Glass Substrates
2个月前
已完结
Design of BGA style Glass Interposer for 2.5D integration of photonic ICs
2个月前
已完结
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