Lv5
1580 积分 2023-10-22 加入
Numerical Analysis and Optimization of Chip-Level Drop Impact Reliability for Chiplet Based on Si Interposer
29天前
已完结
Stress–strain analysis and prediction of WLCSP solder joints under bending–torsion coupled loading
2个月前
已完结
Broadband Characterization of Interconnects in Die-Embedded Glass Interposer
3个月前
已完结
Thermal-Torsion Coupling Loading Analysis and Optimization of 3D PoP Assembly Solder Joints at Different Temperatures
3个月前
已完结
Distribution Optimization of Through-Silicon Via (TSV) Array Based on Genetic Algorithm
3个月前
已完结
Design of Microchannels Embedded in HTCC Substrate for Heat Dissipation of SiP With Multiple Chips
5个月前
已完结
Optimizing thermal performance in high-power-density 3D integrated circuits through advanced microchannel structures and multi-layer cooling
5个月前
已完结
Multi-objective Optimization Study of Stacked BGA Solder Joints under Coupled Bending-Vibration Load and Crosstalk Effects
5个月前
已完结
Investigation of Heat Dissipation and Electrical Properties of Diamond Interposer for 2.5-D Packagings
6个月前
已完结
Thermo-mechanical reliability of glass substrate and Through Glass Vias (TGV): A comprehensive review
9个月前
已完结
皖公网安备34019202002308
