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2210 积分 2023-10-22 加入
Thermo-Mechanical Reliability and Structural Optimization of a Single-Tapered TGV Glass Interposer for 2.5D Packaging
1天前
待确认
Multi-physics coupling reliability enhancement for interconnections of chiplet-based 2.5D packaging with multi-objective optimization through multi-parameter collaboration
8天前
已完结
Multi-physics coupling reliability enhancement for interconnections of chiplet-based 2.5D packaging with multi-objective optimization through multi-parameter collaboration
11天前
已完结
Warpage optimization of memory-computing integrated chiplets with 2.5D packaging subjected to electrical-thermal-vibration multistress coupling
19天前
已完结
A Graphene-Ag-Cu Composite TSV for 3D IC Interconnects With Electrical and Electro-Thermal Analysis
1个月前
已完结
Prediction of crack initiation and fatigue life of TSV under thermal cycling, vibration, and thermo‑vibrational coupled loading
2个月前
已完结
Reliability analysis of TSV silicon perforated structures under thermal cyclic loading
2个月前
已完结
Stress-Strain Analysis and Fatigue Life Prediction of SnBiInZn High-Entropy Alloy QFN Solder Joints Under Random Vibration
3个月前
已完结
Design and Vibration Resistance Performance Analysis of Gallium–Indium Liquid Metal Interconnect Structures at Board Level
3个月前
已完结
Performance optimization of aluminum slit fin-and-tube heat exchangers based on orthogonal experiments and response surface modeling
5个月前
已完结
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