Lv6
2240 积分 2023-10-22 加入
Reliability analysis of large area sintered Cu interconnects based on simulation and thermal shock test
6天前
已完结
Thermo-Mechanical Reliability and Structural Optimization of a Single-Tapered TGV Glass Interposer for 2.5D Packaging
1个月前
已完结
Multi-physics coupling reliability enhancement for interconnections of chiplet-based 2.5D packaging with multi-objective optimization through multi-parameter collaboration
1个月前
已完结
Multi-physics coupling reliability enhancement for interconnections of chiplet-based 2.5D packaging with multi-objective optimization through multi-parameter collaboration
1个月前
已完结
Warpage optimization of memory-computing integrated chiplets with 2.5D packaging subjected to electrical-thermal-vibration multistress coupling
2个月前
已完结
A Graphene-Ag-Cu Composite TSV for 3D IC Interconnects With Electrical and Electro-Thermal Analysis
2个月前
已完结
Prediction of crack initiation and fatigue life of TSV under thermal cycling, vibration, and thermo‑vibrational coupled loading
3个月前
已完结
Reliability analysis of TSV silicon perforated structures under thermal cyclic loading
3个月前
已完结
Stress-Strain Analysis and Fatigue Life Prediction of SnBiInZn High-Entropy Alloy QFN Solder Joints Under Random Vibration
4个月前
已完结
Design and Vibration Resistance Performance Analysis of Gallium–Indium Liquid Metal Interconnect Structures at Board Level
4个月前
已完结
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