Lv62
1960 积分 2023-10-22 加入
Thermomechanical stress optimization in flip-chip packages: Impacts of copper pillar geometry on ultra-low-k layer reliability
20小时前
待确认
Uncertainty Analysis of the Interface Thermal Resistance between Power Module and Heatsink
1个月前
已完结
Investigation on warpage characteristics for ultra-large MCM FCBGA package based on material-structure co-design and intelligent optimization
1个月前
已完结
Optimization for Misalignment of Copper Pillar Bump in Flip Chip Package Using GOA-BP
1个月前
已完结
Thermal-mechanical coupling analysis of Micro-LED bonding based on copper pillar bump
2个月前
已完结
Stress–strain analysis and optimization of BGA stacked solder joints under extreme temperatures based on orthogonal design and grey relational analysis
2个月前
已完结
Study on the optimization of bending-vibration coupling stress of QFN solder joints based on Taguchi orthogonal experimental design and Harris Hawks Optimization algorithm
2个月前
已关闭
Numerical Analysis and Optimization of Chip-Level Drop Impact Reliability for Chiplet Based on Si Interposer
5个月前
已完结
Stress–strain analysis and prediction of WLCSP solder joints under bending–torsion coupled loading
7个月前
已完结
Broadband Characterization of Interconnects in Die-Embedded Glass Interposer
7个月前
已完结
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