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50 积分 2025-10-15 加入
Air-sinterable copper pastes for next-generation electronics: a review
1个月前
已完结
Hybrid copper–silver nanoparticle inks and their performance under thermal and photonic sintering
2个月前
已完结
D-Band Adaptively Biased 16-Way-Combined Half-Watt Power Amplifier in 250-nm InP HBT
2个月前
已完结
Aqueous particle-free Cu–Ag hybrid ink for eco-friendly printed electronics
3个月前
已关闭
Inkjet-printable Cu–Ag MOD ink with in-situ alloying for highly conductive flexible circuits
3个月前
已关闭
Self-catalyzed Cu–Ag particle-free ink for flexible electronics: Low-temperature sintering and oxidation resistance
3个月前
已关闭
Silver–Copper Alloy Nanoinks for Ambient Temperature Sintering
3个月前
已完结
Air-Sinterable Copper Precursor Inks via Mixed Bidentate/Tridentate Ligands
3个月前
已关闭
One step preparation of copper–silver self-catalyzed hybrid conductive ink with reduced sintering temperature for flexible electronics
3个月前
已完结
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