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36 积分 2025-10-15 加入
Metal particle-free inks for printed flexible electronics
7小时前
待确认
Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-silver hybrid tracks at a low temperature below 100 °C
1天前
已完结
Air-sinterable copper pastes for next-generation electronics: a review
3个月前
已完结
Hybrid copper–silver nanoparticle inks and their performance under thermal and photonic sintering
4个月前
已完结
D-Band Adaptively Biased 16-Way-Combined Half-Watt Power Amplifier in 250-nm InP HBT
4个月前
已完结
Aqueous particle-free Cu–Ag hybrid ink for eco-friendly printed electronics
4个月前
已关闭
Inkjet-printable Cu–Ag MOD ink with in-situ alloying for highly conductive flexible circuits
4个月前
已关闭
Self-catalyzed Cu–Ag particle-free ink for flexible electronics: Low-temperature sintering and oxidation resistance
4个月前
已关闭
Silver–Copper Alloy Nanoinks for Ambient Temperature Sintering
4个月前
已完结