Lv520
1298 积分 2021-05-07 加入
Broadband finite-element impedance computation for parasitic extraction
16天前
已完结
Analysis of Device and Circuit Parameters Variability in SiC MOSFETs-Based Multichip Power Module
16天前
已关闭
Investigation of pre-bending substrate design in packaging assembly of an IGBT power module
17天前
已完结
Direct liquid cooling of high performance Silicon Carbide (SiC) power modules
17天前
已完结
A Multi-Objective Optimization Method Based on NSGA-II Algorithm for Electro-Thermal-Stress Collaborative Design of Intelligent Power Modules
17天前
已完结
A Hybrid Thermal Network Model for Evaluating the Junction Temperature of Power Semiconductor Devices
17天前
已完结
Electrical parasitics and thermal modeling for optimized layout design of high power SiC modules
17天前
已完结
Simulation analysis of residual stress of BGA solder joints after reflow soldering based on element birth and death technology
17天前
已完结
Modeling and Assessment of Thermal Impedance Considering Layout and Parameter Dispersion for Multichip SiC Power Module
17天前
已完结
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