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4158 积分 2021-05-07 加入
High-Temperature Characterizations of a Half-Bridge Wire-Bondless SiC MOSFET Module
1个月前
已完结
On-Site Estimation of Thermal Resistance Degradation of Double-Sided Cooling (DSC) Power Modules Under Power Cycling Conditions
1个月前
已完结
Local Interconnection Degradation of a Double-Sided Cooling SiC MOSFET Module Under Power Cycling
1个月前
已完结
Sintered Silver Based Direct-Cooled IGBTs With High Output Power and Thermal Reliability
2个月前
已完结
Self-Oxygenation Silver Paste for SiC Power Modules with High Thermal Dissipation Reliability
2个月前
已完结
Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics
2个月前
已完结
Silver Sintering at Low Temperatures Without Using Pressure: An Approach for Joining Large Area Copper-to-Copper Interconnects
2个月前
已完结
Low temperature sintering of nanosilver paste for super-large-area substrate bonding
2个月前
已完结
Novel Ag salt paste for large area Cu-Cu bonding in low temperature low pressure and air condition
2个月前
已完结
Research on the Key Processes of Large-Area Silver Sintering for SiC Power Modules
2个月前
已完结
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