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1738 积分 2021-05-07 加入
Residual Stress and Warping Analysis of the Nano-Silver Pressureless Sintering Process in SiC Power Device Packaging
1天前
已完结
A PEEC with a new capacitance model for circuit simulation of interconnects and packaging structures
7天前
已完结
A 3-D thermal network model for the temperature monitoring of thermal grease as interface material
7天前
已完结
Applications of the partial element equivalent circuit method in computational electromagnetics simulation: An overview
8天前
已完结
Measurement-Based Parasitic Inductance Network Identification for Multichip Power Modules Based on Inductance Matrix of Loop Wiring Paths
8天前
已完结
Low-Frequency Stabilization for FEM Impedance Computation
8天前
已完结
ParAFEMCap: A Parallel Adaptive Finite-Element Method for 3-D VLSI Interconnect Capacitance Extraction
8天前
已完结
Parasitic Extraction for Multichip Power Modules Using the Frequency-Domain A-Phi Formulation
8天前
已完结
Broadband finite-element impedance computation for parasitic extraction
8天前
已完结
Measurement-Based Parasitic Inductance Network Identification for Multichip Power Modules Based on Inductance Matrix of Loop Wiring Paths
8天前
已完结
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