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3988 积分 2021-05-07 加入
Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics
3天前
已完结
A Review of the Performance and Characterization of Conventional and Promising Thermal Interface Materials for Electronic Package Applications
9天前
已完结
High-performance, safe, and reliable soft-metal thermal pad for thermal management of electronics
9天前
已关闭
Influence of Thermal Cycling on Degradation Behavior of Thermal Greases
9天前
已完结
Accelerated Testing of Thermal Grease Degradation: Combined Thermal Gradients and Forced Mechanical Cycling
9天前
已完结
A comparison study of TIM degradation of phase change material and thermal grease
9天前
已完结
Reliability testing of silicone-based thermal greases
9天前
已完结
Experimental Characterization of Confined, Package-Level Direct Two-Phase Jet Impingement Cooling With Micro-Pin Fin Surface Enhancement
13天前
已完结
A Review of Recent Developments in Pumped Two-Phase Cooling Technologies for Electronic Devices
13天前
已完结
Ageing and Failure Modes of IGBT Modules in High-Temperature Power Cycling
16天前
已完结
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