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3328 积分 2021-05-07 加入
A Double-Side Cooled SiC MOSFET Power Module With Sintered-Silver Interposers: I-Design, Simulation, Fabrication, and Performance Characterization
6天前
已完结
Design of Integrated Gate Drivers for High-Frequency Press-Pack SiC Switch Cells
6天前
已关闭
Multi-Objective Optimization of a 1200-V Fan-Out Panel-Level SiC MOSFET Packaging with Improved Genetic and Particle Swarm Algorithms
6天前
已完结
A Brief Review of Single-Event Burnout Failure Mechanisms and Design Tolerances of Silicon Carbide Power MOSFETs
6天前
已完结
Dynamic Current Balancing Optimization of Cu Clip-Bonded SiC power module Based on Layout-Dominated Parasitic Inductance
6天前
已完结
Thickness Effect of Copper Clips on Power Module Packaging Design
6天前
已完结
A 2.5D Multichip SiC MOSFET Power Module With Low Parasitic Inductance and High Dynamic Current Sharing Performance
6天前
已完结
Single event burnout in SiC MOSFETs induced by nuclear reactions with high-energy oxygen ions
6天前
已完结
Multilayer radiation shield for satellite electronic components protection
6天前
已完结
Single Event Effects of SiC Power MOSFETs: From Neutron Interaction to Destruction at the Die Level
6天前
已关闭
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