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640 积分 2020-10-06 加入
Thermal Numerical Modelling of Complex Electronic Devices
3个月前
已完结
Finite Element Analysis and Multi-Objective Optimization of Solder Joint Temperature Difference and Cooling Stress During PCBA Reflow Process
3个月前
已完结
Novel Copper Foam/Indium Composite Thermal Interface Materials for Advanced Flip Chip Ball Grid Array Packaging
3个月前
已完结
The Transient Thermal Coupling of CBGA Solder Joints in Reflow Soldering: Experimental and Numerical Optimization
3个月前
已完结
Thermal Numerical Modelling of Complex Electronic Devices
3个月前
已完结
A Virtual Prototyping System for Silicon-Carbide Power Modules
3个月前
已完结
Revisiting the effectiveness of diamond heat spreaders on multi-finger gate GaN HEMT using chip-to-package-level thermal simulation
3个月前
已完结
Digital twin in manufacturing: Transient Thermo-Mechanical Simulations
3个月前
已完结
Material considerations for vertical integration of IRFPAs (Conference Presentation)
3个月前
已关闭
Material considerations for vertical integration of IRFPAs (Conference Presentation)
3个月前
已关闭
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