Lv11
20 积分 2026-01-03 加入
Electric‐Field‐Assisted Growth of Vertical Graphene Arrays and the Application in Thermal Interface Materials
1小时前
已完结
Soft and Damping Thermal Interface Materials with Honeycomb‐Board‐Mimetic Filler Network for Electronic Heat Dissipation
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Simultaneous Reduction of Bulk and Contact Thermal Resistance in High‐Loading Thermal Interface Materials Using Self‐Assembled Monolayers
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Liquid droplet-like behaviour of whole casein aggregates adsorbed on graphite studied by nanoindentation with AFM
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A critical review of the preparation strategies of thermally conductive and electrically insulating polymeric materials and their applications in heat dissipation of electronic devices
1小时前
已完结
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