Lv1
50 积分 2026-01-03 加入
The development of thermal interface materials
1天前
已完结
Liquid Metal-Based Chip Cooling Technologies: A Review
1天前
已完结
Paste-like conductive composites through silver-anchored liquid metal networks with high thermal conductivity and electromagnetic shielding
4天前
已完结
Enhancing Photovoltaic-Thermoelectric Generator Systems Using Carbon-Based Thermal Interface Materials: A Comprehensive Review
7天前
已完结
Self‐Layering Porous Cellulose Acetate/Ag Janus Film for Dual‐Mode Radiative Cooling and Heating with High Thermal Conductivity and Electromagnetic Shielding
9天前
已完结
Electric‐Field‐Assisted Growth of Vertical Graphene Arrays and the Application in Thermal Interface Materials
2个月前
已完结
Soft and Damping Thermal Interface Materials with Honeycomb‐Board‐Mimetic Filler Network for Electronic Heat Dissipation
2个月前
已完结
Simultaneous Reduction of Bulk and Contact Thermal Resistance in High‐Loading Thermal Interface Materials Using Self‐Assembled Monolayers
2个月前
已完结
Liquid droplet-like behaviour of whole casein aggregates adsorbed on graphite studied by nanoindentation with AFM
2个月前
已完结
A critical review of the preparation strategies of thermally conductive and electrically insulating polymeric materials and their applications in heat dissipation of electronic devices
2个月前
已完结
皖公网安备34019202002308
