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200 积分 2025-12-16 加入
Effect of Bonding Time on the Microstructure, IMC Growth Behavior, and Shear Properties of Cu/In-48Sn-10Ag/Cu 3D Packaging Solder Joints
1个月前
已关闭
Improved shear property of Sn-3.0Ag-0.5Cu/Ni micro solder joints under thermal shock between 77 K and 423 K by adding TiO2 nanoparticles
1个月前
已完结
Extreme temperature thermal shock induced microstructure degradation and shear property deterioration of Sn3.0Ag0.5Cu/Cu solder joints
1个月前
已关闭
Effect of magnetic field on microstructure and property of Ag-Sn solder alloys
2个月前
已关闭
Influences of rotating magnetic field on microstructure and properties of Sn–Ag–Cu–Sb–Ce solder alloy
2个月前
已完结
Strong composite SnAgCu solder joints with internal aligned carbon fibers by magnetic field
2个月前
已关闭
Investigating the influence of rotating magnetic field (RMF) on intermetallic compound crystallization, thermal and mechanical properties in lead-free Sn-Ag-Cu solder alloys during solidification
3个月前
已完结
Effect of magnetic field on precipitation kinetics and shear strength of Sn58Bi-Ni solders
3个月前
已关闭
Magnetic-field-assisted soldering of Sn-Ag-Cu composite solder reinforced with ferromagnetic graphene/cobalt (CoGNS) particles: Microstructural and mechanical insights
3个月前
已关闭
Magnetic-field-assisted soldering of Sn-Ag-Cu composite solder reinforced with ferromagnetic graphene/cobalt (CoGNS) particles: Microstructural and mechanical insights
3个月前
已关闭
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