Lv11
20 积分 2024-09-02 加入
From lignin subunits to aggregates: insights into lignin solubilization
8小时前
已完结
In Vitro Release Kinetics of Microencapsulated Materials and the Effect of the Food Matrix
8小时前
已完结
Toward Controllable Wet Etching of Monocrystalline Silicon: Roles of Mechanically Driven Defects
2个月前
已完结
Effect of Using High-Pressure Gas Atmosphere with UV Photocatalysis on the CMP Characteristics of a 4H-SiC Substrate
2个月前
已完结
Tribological behavior of 6H–SiC wafers in different chemical mechanical polishing slurries
2个月前
已完结
Controlled corrosion behaviors of copper in oxidizer solutions for chemical mechanical polishing: Influence of the decomposition products
3个月前
已完结
An optimization strategy for improving the aspect ratio of screen printing electronic paste based on rheological properties
3个月前
已完结
Abrasive Materials for Semiconductor Chemical Mechanical Polishing: Composition, Performance, and Emerging Trends
3个月前
已完结
Concentration-gradient-driven nanocapsule formation
3个月前
已完结
Optimization of Diamond Polishing Process for Sub-Nanometer Roughness Using Ar/O2/SF6 Plasma
4个月前
已完结
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