Lv21
164 积分 2024-11-26 加入
Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm2) power chips for electronics packaging
6小时前
已完结
Pressureless sinter-joining of micron-Ag flake pastes at 160 °C enabled by solvent and interface engineering
2个月前
已完结
Feasibility Investigation and Characterization of Liquid Dispersant–Assisted Sintering of Silver to Bond Large‐Area Plates
2个月前
已完结
Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste
3个月前
已完结
Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere
3个月前
已完结
Simulation, Prediction and Verification of the Thermal and Electrical Properties of Sintered Copper Joints with Random Pore Structure for Power Electronics Packaging
3个月前
已完结
Development of Multimodal Metal Particle Pastes Using Computer Simulation Technology
3个月前
已完结
Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study
4个月前
已完结
Oxidation-enhanced bonding strength of Cu sinter joints during thermal storage test
4个月前
已完结
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