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50 积分 2024-11-26 加入
Superior sinterability of copper oxalate-coated Cu particles in a double reductant system and rapid compression sinter-bonding characteristics between Cu finishes
6天前
已完结
Rapid sintering by thermo-compression in air using a paste containing bimodal-sized silver-coated copper particles and effects of particle size and surface finish type
6天前
已完结
In situ study of electrochemical migration of Sn3Ag0.5Cu solder reinforced by Cu6Sn5 nanoparticles
6天前
已完结
Corrosion protection mechanisms of Organic Solderability Preservatives (OSP) on Printed Circuit Boards (PCBs) for automotive applications
1个月前
已完结
Sintered-copper Die-attach: Processing, Properties, and Reliability
1个月前
已关闭
Thermal reliability of Cu sintering joints for high-temperature die attach
1个月前
已完结
Comparative Study on Power Cycling Capabilities of SiC Power MOSFET and Si IGBT Baseplate-Less Power Modules
1个月前
已完结
Electrical and Microstructural Reliability of Pressureless Silver-Sintered Joints on Silicon Carbide Power Modules Under Thermal Cycling and High-Temperature Storage
2个月前
已完结
Process Development of Tlps Joint and Their Mechanical, Thermal and Power Cycling Reliability
2个月前
已完结
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