Lv21
156 积分 2024-11-26 加入
Influence of Au Substrate Crystal Structure on Ag-Au Inter-diffusion for WBG Packaging
7小时前
待确认
Pressureless sinter-joining of copper pastes below 200 °C via multi-solvent collaborative engineering
24天前
已完结
A Novel High-Performance Double-Sided Cooling SiC Power Module Based on Cu Sintering
1个月前
已完结
Current-assisted low-temperature silver sinter bonding to silicon carbide by utilizing ion migration
5个月前
已关闭
Reliability analysis of sintered Cu joints for SiC power devices under thermal shock condition
5个月前
已完结
Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm2) power chips for electronics packaging
5个月前
已完结
Pressureless sinter-joining of micron-Ag flake pastes at 160 °C enabled by solvent and interface engineering
8个月前
已完结
Feasibility Investigation and Characterization of Liquid Dispersant–Assisted Sintering of Silver to Bond Large‐Area Plates
8个月前
已完结
Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste
8个月前
已完结
Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere
9个月前
已完结
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