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28 积分 2025-01-15 加入
Line-edge roughness increase due to wiggling enhanced by initial pattern waviness
11天前
已关闭
Charging Issues on the Rectangle Mask Line During Plasma Etching with Consideration of Electron-Solid Interaction
11天前
已完结
Line width roughness accuracy analysis during pattern transfer in self-aligned quadruple patterning process
11天前
已完结
Three-dimensional line edge roughness in pre- and post-dry etch line and space patterns of block copolymer lithography
12天前
已完结
Recent advances in plasma etching for micro and nano fabrication of silicon-based materials: a review
2个月前
已完结
Methods of Reducing Etching Defects in Back End of Line for Semiconductor in 28NM Technology
2个月前
已完结
In-situ Cleaning of Post-etch Byproducts by Manipulating Dechucking Environment Gas in Silicon Etch Process
3个月前
已完结
A Particle Reduction Strategy for Plasma Etching Processes
3个月前
已完结
Middle of Line (MoL) Cleaning Challenges in Sub-20nm Node Device Manufacturing
3个月前
已完结
Patterning exploration of 16 nm pitch metal lines using spacer-is-dielectric EUV-based self-aligned double patterning
4个月前
已完结
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