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14 积分 2026-03-03 加入
Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: A review
19天前
已完结
Comparison of Pin Surface Heat Transfer in Arrays of Oblong and Cylindrical Pin Fins
25天前
已完结
Thermal modeling of diamond-based power electronics packaging
1个月前
已完结
High-performance heat sinking for VLSI
1个月前
已完结
Investigation of Liquid Flow in Microchannels
3个月前
已完结
The Flow Resistance and Heat Transfer Characteristics of Micro Pin-Fins with Different Cross-Sectional Shapes
3个月前
已完结
Experimental and Numerical Study of a Stacked Microchannel Heat Sink for Liquid Cooling of Microelectronic Devices
3个月前
已完结
Experimental and numerical study of pressure drop and heat transfer in a single-phase micro-channel heat sink
3个月前
已完结
Investigation of Liquid Flow in Microchannels
3个月前
已完结
Numerical study of distributed jet microchannels with Micro-pin-fins: Structural comparison and temperature uniformity optimization
5个月前
已完结
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