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40 积分 2026-09-16 加入
Interfacial microstructure and properties of diamond/Cu‐ x Cr composites for electronic packaging applications
14分钟前
待确认
Thermal expansion behaviour and dimensional stability of Diamond/Cu composites with different diamond content
18分钟前
已完结
Enhancing thermal conductivity of Diamond/Cu composites by regulating distribution of bimodal diamond particles
19天前
已完结
Lightweight diamond/Cu interface tuning for outstanding heat conduction
1个月前
已完结
Tailoring interfacial bonding states of highly thermal performance diamond/Al composites: Spark plasma sintering vs. vacuum hot pressing
1个月前
已完结
Fabrication of diamond/aluminum composites by vacuum hot pressing: Process optimization and thermal properties
1个月前
已完结
Fabrication of diamond particles reinforced Al-matrix composites by hot-press sintering
1个月前
已完结
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