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2023-07-01 加入
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Process integration for on-chip interconnects
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Characterization techniques of ion bombardment damage on electronic devices during plasma processing—plasma process-induced damage
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AC TDDB Analysis for HK/IL Gate Stack Breakdown and Frequency-dependent Oxygen Vacancy Trap Generation in Advanced nodes FinFET Devices by SILC Spectrum Methodology
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An improved method for measuring epi-wafer thickness based on the infrared interference principle: Addressing interference quality and multiple interferences in double-layer structures
8个月前
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Reliability challenges in CMOS technology: A manufacturing process perspective
9个月前
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