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30 积分 2023-07-01 加入
Nanostructured Etching of Ruthenium in Three-Component Cl2/O2/Ar Plasma
2个月前
已完结
Nanostructured Etching of Ruthenium in Three-Component Cl2/O2/Ar Plasma
2个月前
已完结
Alkali Wet Chemicals for Ru with Advanced Semiconductor Technology Nodes
2个月前
已完结
Patterning challenges for direct metal etch of ruthenium and molybdenum at 32 nm metal pitch and below
2个月前
已完结
Redefining 2-Level Semi-Damascene Interconnect Technology: Benchmarking three different Fully Self-aligned Via options
2个月前
已完结
Optimization of Metal Line Thickness & CD and Effect on RC Delay
3个月前
已完结
Effect of electrical stress on time dependent dielectric breakdown (TDDB) tolerate capability of HfO2–ZrO2 ferroelectric films with different thicknesses
3个月前
已完结
Understanding electromigration failure behaviors of narrow cobalt lines and the mechanism of reliability enhancement for extremely dilute alloying of manganese oxide
3个月前
已关闭
Failure Mechanism of Stress Migration in Via Sidewall for Dual Damascene Cu Interconnection
3个月前
已完结
Investigation of Copper Interconnects Suffered Reliability Physics for Advanced Packaging Architecture
3个月前
已完结
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