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60 积分 2023-07-01 加入
Effect of electrical stress on time dependent dielectric breakdown (TDDB) tolerate capability of HfO2–ZrO2 ferroelectric films with different thicknesses
4天前
已完结
Understanding electromigration failure behaviors of narrow cobalt lines and the mechanism of reliability enhancement for extremely dilute alloying of manganese oxide
7天前
已关闭
Failure Mechanism of Stress Migration in Via Sidewall for Dual Damascene Cu Interconnection
11天前
已完结
Investigation of Copper Interconnects Suffered Reliability Physics for Advanced Packaging Architecture
11天前
已完结
Understanding electromigration failure behaviors of narrow cobalt lines and the mechanism of reliability enhancement for extremely dilute alloying of manganese oxide
13天前
已关闭
Bias Temperature Instability of MOSFETs: Physical Processes, Models, and Prediction
15天前
已完结
Aging measurement and empirical modeling of BTI on FPGA using 16 nm FinFETs for static and dynamic stresses
16天前
已关闭
Addressing interconnect challenges for enhanced computing performance
1个月前
已完结
Investigating the degradation and products of thermo-oxidation of polyimide-based engineering plastics
1个月前
已完结
Reliability Study of Critical Structural Redistribution Layers in Advanced Packaging: A Review
3个月前
已完结
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