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An interlayer strategy for co-optimizing contact thermal resistance and thermomechanical stress in hybrid indium/carbon fiber/indium thermal interface materials for large-die packages
16小时前
已完结
Thermal-mechanical reliability enhancement of thermal interface material in lidded FCBGA packaging via SVR-based coverage degradation prediction
16小时前
已完结
Investigating the Thermal Resistance of the Si and Epoxy Interface
3天前
已完结
Thermal management in electronic systems using the inverse piezoelectric effect: A comprehensive review
3天前
已完结
Investigation of thermal-fluid-solid coupling characteristics and thermal strain in nickel-based rare earth alloy microchannel heat sinks
3天前
已完结
Efficient outdoor thermal comfort via radiant cooling and infrared-reflective walls
1年前
已完结
Dome-celled aerogels with ultrahigh-temperature superelasticity over 2273 K
1年前
已完结
A Review of Recent Developments in “On-Chip” Embedded Cooling Technologies for Heterogeneous Integrated Applications
1年前
已完结
Review of jet impingement cooling of electronic devices: Emerging role of surface engineering
1年前
已完结
A comprehensive review of cold plate liquid cooling technology for data centers
1年前
已完结
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