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274 积分 2021-01-29 加入
Liquid metal as a dynamic thermal bridge for high-performance epoxy molding compounds with continuous heat transfer networks
10小时前
已完结
Performance Comparison of Various Thermal Interface Materials Used with Metal Foams
2天前
已完结
Effect of Silane Coupling Agent on The Performance of Electrically Conductive Adhesives
2天前
已完结
Conversion‐Controlled Poly(Ionic Liquid)/Aluminum Nitride Thermal Interface Materials with Internal Plasticization for Reliable Chip‐Level Thermal Management
2天前
已完结
Optimization of the Adhesion and Thermal Conductivity of Thermal Interface Materials for Chip Immersion Cooling via Grafting Polar Groups
5天前
已完结
Interfacial interaction-induced super-wettability of gallium-based liquid metals: a review
6天前
已完结
Strain–driven preferential chain orientation enables enhanced thermal transport and preserved mechanical compliance in thermal interface materials
7天前
已完结
Thermal resistance of Open-Cell metal foam with thermal interface materials (TIM)
7天前
已完结
A self-adaptive thermal Interface material with dual-network fixation and confined flow for warped Chip thermal management
7天前
已完结
Dispensible multi-functional EMI gap filler for ADAS applications
8天前
已完结
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