Lv12
38 积分 2026-09-01 加入
Role of annealed copper plasticity in process-induced warpage of SiC power modules
21小时前
待确认
Effect of Thermal Cycle Temperature Gap on Thermal Fatigue of Metallized Silicon Nitride Substrates for SiC Power Modules
5天前
已完结
Simplified Swarm Optimization for Surrogate-Assisted Reliability Design of Insulated-Gate Bipolar Transistor Power Modules Using an Open-Source Process Finite-Element Model
6天前
已完结
A Study of the Effects of Cyclic Thermal Stresses on a Ductile Metal
1个月前
已完结
Thermal Shock Life Prediction of the SiC Wide Bandgap Power Module Semiconductor Package Considering Creep Behavior of the Ag Sintered Interconnect and Viscoelastic Properties of the Epoxy Molding Compound
1个月前
已完结
Numerical Evaluation of Sintered Silver Die Attachments Based on Different Material Parameters and Creep Constitutive Models
1个月前
已完结
Applying Anand versus Garofalo creep constitutive models for simulating sintered silver die attachments in power electronics
1个月前
已完结
Constitutive, creep, and fatigue behavior of sintered Ag for finite element simulation of mechanical reliability: a critical review
1个月前
已完结
Optimize Power Module Sintering Methodology for High Thermal Conductivity and Reliability
1个月前
已完结
Experimental characterizations of the influence of sintering pressure on the high-temperature tensile behavior of sintered silver
1个月前
已完结
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