Lv3
288 积分 2025-02-17 加入
Numerical simulation of copper electrodeposition for Through Silicon Via (TSV) with SPS-PEG-Cl additive system
3个月前
已完结
A two-stage thermal-aware design strategy for chiplet placement and TSV optimization in 2.5D integrated systems
3个月前
已完结
The Role of Multiplicative Objects in Students’ Reasoning With Formulas
4个月前
已关闭
Predicting TSV depth using laser drilling by simulation model and neural network
5个月前
已完结
The simulation of copper deposition in through silicon vias and investigation on effects of additives
5个月前
已完结
Predicting TSV depth using laser drilling by simulation model and neural network
5个月前
已完结
Intelligent Multifield Collaborative Optimization Method for TSV Array With Performance Constraints
5个月前
已完结
A Modeling Study on Electrical and Thermal Behavior of CNT TSV for Multilayer Structure
5个月前
已完结
Probing Confinement Effects on the Infrared Spectra of Water with Deep Potential Molecular Dynamics Simulations
5个月前
已关闭
Comparative simulations of CO2 adsorption on diverse carbon materials via machine learning-based molecular dynamics
5个月前
已完结
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