| 标题 |
A two-stage thermal-aware design strategy for chiplet placement and TSV optimization in 2.5D integrated systems |
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| DOI | |
| 其它 |
期刊:Journal of Computational Electronics 作者:Zhangxi Xia; Zhongliang Pan 出版日期:2026-05-19 |
| 求助人 | |
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(2025-6-4)