Lv3
250 积分 2025-11-19 加入
The impact of various arc ion plating parameters on the deposition speed of copper thin films
1个月前
已完结
Influence of gas pressure and cathode composition on ion energy distributions in filtered cathodic vacuum arcs
1个月前
已完结
Role of metals and metal-deactivators in polymer degradation
1个月前
已完结
Self-assembled layer as an effective way to block copper diffusion into epoxy
1个月前
已完结
Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate
1个月前
已完结
Effects of high temperature and high humidity on the reliability of copper/epoxy bond
1个月前
已完结
Diffusion of metals in polymers
1个月前
已完结
Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature
1个月前
已完结
Comparative study on microstructure and properties of different designed PTFE/Cu materials
3个月前
已完结
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