Lv2
128 积分 2024-03-03 加入
Boosting surface conduction of topological insulator enabling a novel and high-performance Sb2Te3 cathode via a simple ball-milling method for zinc-ion batteries
11天前
已完结
Formation of Cu6Sn5 phase by cold homogenization in nanocrystalline Cu–Sn bilayers at room temperature
22天前
已完结
Effect of bonding temperature on the microstructure, IMCs growth, and shear property of Cu/Sn-9Zn-30Cu/Cu solder joint by transient liquid phase bonding
22天前
已完结
Grain structure modification of Cu-Sn IMCs by applying Cu-Zn UBM on transient liquid-phase bonding in novel 3D-IC technologies
22天前
已完结
Transient liquid phase bonding in the Cu-Sn system
22天前
已完结
Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process
22天前
已完结
Inorganic–Organic Co‐Intercalated [Al 0.16 (C 5 H 14 ON) 0.12 ]V 2 O 5 ·0.39H 2 O Cathode for High‐Performance Aqueous Zinc‐Ion Batteries
1个月前
已完结
Chemically converted volume-resilience interface enables high-capacity zinc anode
1个月前
已完结
Electrochemically and chemically in-situ interfacial protection layers towards stable and reversible Zn anodes
1个月前
已完结
Interfacial modulation and performance enhancement of zinc-modified copper foil collectors for sodium-metal batteries
2个月前
已关闭
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