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33 积分 2021-12-31 加入
Evaluation of low thermal resistance film type TIM for FCBGA package
2天前
已完结
Advances in flexible thermal Interface materials with low contact thermal resistance
10天前
已完结
Progress in Fine-Line Front-Side Printing for TOPCon Solar Cells
13天前
已完结
Breaking Thermal Conductivity–Electrical Resistivity Trade‐Off in Liquid Metal–Based Thermal Interface Materials via Interface Engineering
1个月前
已完结
Reduced‐Reflectance Bionic E‐Skin with Electromagnetic–Environmental–Sensing Integration Enabled by Ni‐Reconstructed Liquid Metal Networks
1个月前
已完结
Mechanochemistry-mediated colloidal liquid metals for electronic device cooling at kilowatt levels
1个月前
已完结
Bioinspired Non‐Embrittling Phase‐Inverted Oil‐in‐Liquid Metal Thermal Grease as a High‐Performance Thermal Interface Material
2个月前
已完结
Surface coordination layer passivates oxidation of copper
2个月前
已完结
A molecular pathway to corrosion-resistant printable copper
3个月前
已完结
MXene-Assembled Liquid Metal Hybrid Microparticles for Multifunctional and Stretchable Printed Electronics
3个月前
已完结
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