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22 积分 2025-11-05 加入
Integrated electrochemical characterization and finite element modeling for optimizing copper filling in through-glass Vias: Kinetic parameter extraction and profile prediction
6天前
已完结
Research on low-temperature thermocompression bonding of glass substrates assisted by nano titanium passivation layer
12天前
已完结
Investigation of the interfacial thermal resistance of Cu/Ta heterostructure in the through glass via wafer
20天前
已完结
Study on Microstructural Evolution Mechanisms of Amorphous $\text{SiO}_{2}$ in Through Glass via Wafer During Thinning
26天前
已完结
Laser-induced interfacial bonding and structural evolution of carbon layers on borosilicate glass via sequential ultrafast laser chemical vapor deposition
1个月前
已完结
Thermally and Structurally Robust Design of Through Glass via Arrays Using Multi-objective Optimization and Machine Learning-Based Geometry Prediction
1个月前
已完结
Rapid and complex dynamics of through glass via formation using a picosecond quasi-continuous wave laser as revealed by time-resolved absorptance measurements and multiphase modeling
1个月前
已完结
Through glass via technology for advanced packaging: fabrication, metallization, applications, and reliability challenges
1个月前
已完结
Unraveling degradation mechanisms, microstructure evolution, and thermal-mechanical behavior of TGV-Cu interconnects in advanced glass packaging under thermal cycling
1个月前
已完结
Sustainable formaldehyde-free copper electroless plating on carbon-epoxy substrates
1个月前
已完结
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