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32 积分 2025-11-05 加入
Through glass via technology for advanced packaging: fabrication, metallization, applications, and reliability challenges
18小时前
待确认
Unraveling degradation mechanisms, microstructure evolution, and thermal-mechanical behavior of TGV-Cu interconnects in advanced glass packaging under thermal cycling
8天前
已完结
Sustainable formaldehyde-free copper electroless plating on carbon-epoxy substrates
13天前
已完结
Reduction of thermally induced waveguide degradation in the laser glass deposition of optical fibers through melt pool adaption
1个月前
已完结
Investigation of removal mechanisms and conditions of GaN under ultrafast laser irradiation and their effects on surface micro/nano structures
1个月前
已完结
AI-driven real-time optimization of laser welding: A low-latency approach for high quality welds
1个月前
已完结
Comparison of keyhole and molten pool behavior in pure copper welding using IR laser with ring shape formed by diffractive optical element and Blue-IR hybrid laser
2个月前
已完结
Ultrasonic-assisted wetting behaviors of Sn solder on (111) nano-twinned Cu electroplating films for UBM
2个月前
已完结
Research on laser-induced asymmetric low-damage thermal cleavage cutting technology for glass
2个月前
已完结
Laser-based welding of thick-walled borosilicate glass containers by gravity-assisted sinking without additional material
2个月前
已完结
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