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490 积分 2025-08-28 加入
A self-attentive physics-informed and data-driven framework for predicting solder joint reliability in printed circuit board assemblies under thermal aging
14天前
已完结
What is the Young's Modulus of Silicon?
1个月前
已关闭
What is the Young's Modulus of Silicon?
1个月前
已完结
Investigation of Post-Bond Distortion in Direct Wafer Bonding
1个月前
已完结
Multi-Physics Simulation of Wafer-to-Wafer Bonding Dynamics
1个月前
已完结
Direct silicon bonding dynamics: A coupled fluid/structure analysis
1个月前
已完结
Precise determination of lattice parameter and thermal expansion coefficient of silicon between 300 and 1500 K
1年前
已完结
Thermal Conductivity of Silicon and Germanium from 3°K to the Melting Point
1年前
已完结
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