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12 积分 2025-10-08 加入
Copper Particle Sintering for Low‐Temperature Electronic Joining: A Review of Materials Design and Processing Strategies
1小时前
已完结
Nano-copper sintering technology for packaging of silicon carbide power devices: Recent advances in anti-oxidation strategies, low-temperature interconnection mechanisms, and reliability
1小时前
已完结
A new one-component electrically conductive adhesive with excellent electrical conductivity and mechanical properties using tetra-functional polyurethane acrylate oligomers and silver particle fillers
2个月前
已完结
Exploration of organic matrixes in conductive silver paste: a comprehensive review
2个月前
已完结
释放有限元方法在材料科学中的力量
11个月前
已完结
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