| 标题 |
Nano-copper sintering technology for packaging of silicon carbide power devices: Recent advances in anti-oxidation strategies, low-temperature interconnection mechanisms, and reliability |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Alloys and Compounds 作者:Aihua Sun; 刘苗青; Fupeng Huo; Peng Zhang; Lei Duan; et al 出版日期:2026-08-21 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)