Lv11
10 积分 2026-05-09 加入
Laser texturing of silicon surface to enhance nucleate pool boiling heat transfer
12分钟前
待确认
Forced boiling of nonazeotropic immiscible mixture in a supercapillary microchannel array for ultra-high heat flux removal with chip junction temperature below 85°C
33分钟前
已完结
Chip cooling with manifold-capillary structures enables 105 COP in two-phase systems
19天前
已完结
Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance
1个月前
已完结
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices
1个月前
已完结
A Review of Femtosecond Laser Processing of Silicon Carbide
1个月前
已完结
High-Performance Silicon HU-Type Manifold Microchannel Heat Sink for High-Heat-Flux Thermal Management
1个月前
已完结
Design and Fabrication of Embedded Microchannel Cooling Solutions for High-Power-Density Semiconductor Devices
1个月前
已完结
Jet-enhanced manifold microchannels for cooling electronics up to a heat flux of 3,000 W cm−2
1个月前
已完结
Direct preparation of diamond heat dissipation microchannel assemblies by picosecond laser
1个月前
已完结
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