| 标题 |
Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module |
| 网址 | |
| DOI |
10.1115/1.4062384
doi
|
| 其它 |
期刊:Journal of Electronic Packaging 作者:Yujui Lin; Tiwei Wei; Wyatt Jason Moy; Hao Chen; Man Prakash Gupta; et al 出版日期:2023-04-22 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)