Lv12
46 积分 2023-02-08 加入
Effect of aerostatic spindle dynamic characteristics on the medium frequency waviness error of silicon wafer surface
18小时前
待确认
A study on surface grinding of 300 mm silicon wafers
18小时前
待确认
A new model of grit cutting depth in wafer rotational grinding considering the effect of the grinding wheel, workpiece characteristics, and grinding parameters
5个月前
已完结
Undeformed chip width non-uniformity modeling and surface roughness prediction in wafer self-rotational grinding process
11个月前
已完结
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