Lv11
70 积分 2024-05-06 加入
An improved computational constitutive model for brittle materials
13天前
已完结
First-principles equation-of-state table of silicon and its effects on high-energy-density plasma simulations
13天前
已完结
Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding
15天前
已完结
A load identification method for the grinding damage induced stress (GDIS) distribution in silicon wafers
15天前
已完结
Subsurface damage measurement of ground fused silica parts by HF etching techniques
15天前
已完结
Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments
15天前
已完结
Surface quality and residual stress variation of ceramics after abrasive grinding under pre-compressive stress
15天前
已完结
Speed effect on the material behavior in high-speed scratching of BK7 glass
15天前
已完结
An Etch for Delineation of Defects in Silicon
21天前
已完结
Hybrid micro-grinding process for manufacturing meso/micro-structures on monocrystalline silicon
27天前
已完结
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