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80 积分 2023-11-26 加入
Development of Slurry Formulations for Molybdenum-Chemical Mechanical Planarization (Mo-CMP)
5天前
已关闭
Atlas of electrochemical equilibria in aqueous solutions
9个月前
已完结
Effect of Corrosion Inhibitor BTA on Silica Particles and their Adsorption on Copper Surface in Copper Interconnection CMP
10个月前
已完结
Synergetic Effect of Chemical Components in a Tungsten CMP Slurry and the Evolution of Tungsten Surface Species
10个月前
已完结
Synergistic effects of PBTCA and ABO on the chemical mechanical polishing of titanium barrier layers in TSV application
10个月前
已完结
Effect of Novel pH Regulators on Copper film Chemical Mechanical Polishing for Ruthenium-Based Copper Interconnect under Weak Alkalinity Conditions
10个月前
已完结
Experimental and computational investigation of complexing agents on copper dissolution for chemical mechanical polishing process
10个月前
已完结
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