Lv21
198 积分 2023-05-31 加入
Improved anchor design for flat MEMS structure by suppressing deformation due to buried-oxide stress on silicon-on-insulator wafer
11天前
已完结
Challenges and Technologies of Frontside Via-Last Active-Interposer Processes on Low-k Material for 3-D Chiplet
28天前
已完结
Planarization by radio‐frequency bias sputtering of aluminum as studied experimentally and by computer simulation
1个月前
已完结
Planar deposition of aluminum by RF/dc sputtering with RF bias
1个月前
已完结
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