Lv11
40 积分 2024-08-02 加入
Nano-Through Silicon Vias (nTSV) for Backside Power Delivery Networks (BSPDN)
11小时前
待确认
Process-Integrated Co-Optimization(PICO) of Etch Profile and Metal Fill for Nano Through-Silicon Via (nTSV) Fabrication
11小时前
已关闭
Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing
11小时前
待确认
Water electrolysis
4个月前
已完结
Dynamics in electrochemical organic oxidation reactions from in situ and operando techniques
6个月前
已完结
First-principles approaches and concepts to simulate electrochemical interfaces
6个月前
已完结
Suppressing lattice oxygen oxidation in ruthenium oxide via equivalent substitution for sustainable oxygen evolution reaction in PEMWEs
1年前
已完结
皖公网安备34019202002308
