| 标题 |
Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing |
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| 其它 |
期刊:2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) 作者:W. Hafez; P. Agnihotri; M. Asoro; M. Aykol; B. Bains; et al 出版日期:2023-06-11 |
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(2025-6-4)