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Moisture absorption behavior of printed circuit laminate materials, advances in electronic packaging
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| 其它 | Liu, P.C., Wang, D.W., Livingston, E.D., Chen, W.T., “Moisture absorption behavior of printed circuit laminate materials, advances in electronic packaging”, Proceedings of the 1993 ASME International Electronics Packaging Conference, Vol. 1, American Society of Mechanical Engineers, Binghamton, NY, September 29–October 2, pp. 435–442, 1993. Also quoted in ref. |
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