| 标题 |
A comparative study of cetylpyridinium chloride and cetyltrimethyl ammonium chloride as levelers in acidic copper electroplating: Electrochemical evaluation and theoretical calculation |
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| DOI | |
| 其它 |
期刊:Materials Today Communications 作者:Hong-Tao Jiang; Xinchao Zhang; Ya-Wen Wang; Chaolin Tan; Haobin Zou; et al 出版日期:2025-03-01 |
| 求助人 | |
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(2025-6-4)