| 标题 |
Evaluation of tribologically-induced subsurface damages in monocrystalline silicon wafers using selective etching |
| 网址 | |
| DOI | |
| 其它 |
期刊:Tribology International 作者:Jian Gao; Huaicheng Zhou; Jin Li; Lei Wu; Linmao Qian; et al 出版日期:2026-08-01 |
| 求助人 | |
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(2025-6-4)