| 标题 |
A Temporary Bonding De-Bonding Tape with High Thermal Resistance, Easy peeling and Excellent TTV for 3DIC |
| 网址 | |
| DOI | |
| 其它 |
期刊:2024 International 3D Systems Integration Conference (3DIC) 作者:Moeki Nakano; Shigenori Nagahama; Toshio Takahashi; Takuya Yamamoto 出版日期:2024-09-25 |
| 求助人 | |
| 下载 |
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(2025-6-4)