| 标题 |
Effect of secondary solution processing on microstructure and properties of the newly designed Cu-Ni-Si alloy |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Physics: Conference Series 作者:Hu Wang; Wanyu Wang; Zhongping Chen 出版日期:2026-04-01 |
| 求助人 | |
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(2025-6-4)