| 标题 |
Modeling and Characterization of Annealing-Induced Cu Protrusion of TSVs With Polyimide Liner Considering Diffusion Creep Behavior |
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| DOI | |
| 其它 |
期刊:IEEE Transactions on Electron Devices 作者:Baoyan Yang; Yingtao Ding; Zhiqiang Cheng; Anrun Ren; Lei Xiao; et al 出版日期:2022-12-20 |
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(2025-6-4)