| 标题 |
Transmission electron microscopy study of the failure mechanism of the diffusion barriers (TiN and TaN) between Al and Cu |
| 网址 | |
| DOI | |
| 其它 |
期刊:Metals and Materials International 作者:Soo-Hyun Kim 出版日期:2017-01-01 |
| 求助人 | |
| 下载 |
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(2025-6-4)